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Bespoke Ceramic Components

Due to the ever increasing demand for Precision engineered ceramic components Multi-Ceramic Technology was formed in August 2009.

The focus of this company was to aid our customers both current and new to design and attain various ceramic parts in various forms and materials for their ever increasing applications.

With the support from our Global partners we can offer CIM ceramic injection moulding and this has enabled us to expand other lines such as IR & UV products and services.

Working with customers to stock critical parts on the shelf on a ‘call-off’ basis ensures next day delivery.

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INJECTION MOLDED CERAMIC PRODUCTS
multi lab - injection molding
injection molding - multi lab
MATERIAL PROPERTIES & SPECIFICATIONS
Capabilities
  • Design
  • Engineering
  • Injection Molding
  • Material Science/Processing
  • Metallizing
  • Sintering
  • Tooling
Finishing Operations
  • Brazing
  • Ceramic Grinding
  • Diamond Sawing
  • Electrolytic/Electroless Plating
  • Lapping
  • Post Fire Metallization
  • Ultrasonic Machining
Ceramic Materials
  • Alumina
  • High Purity Alumina
  • Zirconia Toughened Alumina
Metallization Options
refactory metal
Metallization Resistances
Surface: .005 ohm/sq (Gold Plated)
Brazed Compnent materials
  • Alloy 194
  • Alloy 42
  • Copper Alloy
  • Copper Tungsten
  • Kovar
  • Molybdenum
Injection Molding Advantages
  • Ability to produce near net-shape parts
  • Advanced materials availible to meet specific application needs
  • Cost effective techniques for complex shapes
  • Cost effective, high volume manufaturing runs
  • Low cost tooling
  • Quick turn ceramic prototypes for customer development
  • Tight tolerance control
Production Volumes
Prototype to High Production
DESIGN GUIDELINES
Section Thickness
Cross sections with uniform wall thickness are desirable.
Process Characteristics
Draft angles, parting lines, flow lines, and ceramic flashes can be minimized by Multi Lab engineers who will work with you on your design.
Recommended Radii
Sharp corners can be designed to a minimum of 0.010" radius where required. Internal cavity radii should be designed with a more generous fillet. Contact Multi Labs technical staff for assistance with specific design considerations.
Undercuts
External tapers and undercuts are possible, however as a general rule, undercuts should be avoided.
Tolerances
Without secondary operations, Multi Labs process is capable of tolerances of ± .5% to ± 1% NLT ± .0762 mm (.003") Surface flatness is typically .0762 mm (.003"/ inch) or better. The smallest part is typically 1.2 grams (.042 oz)and the largest part is typically 150 grams (5.29 oz). Larger and smaller custom parts are possible. Review your requirements with Multi Labs technical staff.
Finishing Operations
After sintering, the parts are inspected to high quality standards. Additional operations may be performed such as plating, brazing or machining as required.
PLATING SPECIFICATIONS
Types of Plating
  • Electroless Gold
  • Electroless Nickel
  • Electrolytic Gold
  • Electrolytic Nickel
Gold Electroless Standards Met
Meets MiL-G-45204 or AMS 2422
Gold Electrolytic Standards Met
Meets MiL-G-45204 or AMS 2422
Nickel Electroless Standards Met
AMS 2404
Nickel Electrolytic Standards Met
SAE AMS-QQ-N-290
Electrolytic and Electroless Nickel Plating
50µ" TO 300µ"
Electrolytic and Electroless Gold Plating
30µ" TO 100µ"
INJECTION MOLDING PROCESS
Applications
Multi Labs technical team will help guide your design to meet the tooling requirements for maximized manufacturability.
Materials Preparation
High purity ceramic is mixed with a proprietary blend of organic materials called "binders," and processed into a fluid base with rheological properties for mold filling.
Molding
The material is injected into a mold with single or multiple cavities under pressure. The green part is then rapidly ejected from the mold.
De-binding
The binders are removed through thermal processing.
Sintering
The ceramic parts are fired at high temperatures in excess of 1600°C that allows the part to reach density.
Finishing Operations
After sintering, the parts are inspected to high quality standards. Additional operations may be performed such as plating, brazing or machining as required.
99% ALUMINA PROPERTIES
Color
White
Density
3.8 g/cc (0.137 #/cu. in.)
Hardness
1200 kg/mm 2
Flexural Strength
410 MPa (60 psi x 10 3)
Youngs Modulus
300 GPa (43.5 psi x 10 6)
Shear Modulus
120 GPa (17 psi x 10 6)
Thermal Expansion (25-300 Degrees C)
7.5 10 -6/ºC (4.17x 10 -6/ºF)
Thermal Conductivity (25 Degrees C)
25 W/mK (173 BTU-in/ft 2-h-ºF)
Dielectric Strength
11 kv/mm (280 volts/mil)
Volume Resistivity
>10 14 ohm-cm 2/cm
Dielectric Constant (30GHz)
9.4
>99% ALUMINA PROPERTIES
Color
White
Density
3.85 g/cc (0.139 #/cu. in.)
Hardness
1400 kg/mm 2
Flexural Strength
430 MPa (62 psi x 10 3)
Youngs Modulus
340 GPa (49 psi x 10 6)
Shear Modulus
130 GPa (19 psi x 10 6)
Thermal Expansion (25-300 Degrees C)
8.0 10 -6/ºC (4.44x 10 -6/ºF)
Thermal Conductivity (25 Degrees C)
30 W/mK (208 BTU-in/ft 2-h-ºF)
Dielectric Strength
11 kv/mm (280 volts/mil)
Volume Resistivity
>1014 ohm-cm 2/cm
Dielectric Constant (30GHz)
9.6
METALLIZABLE >90% ALUMINA (AL2O3) PROPERTIES
Color
black or White
Density
3.62 g/cc (0.131 #/cu. in.)
Hardness
1207 kg/mm 2 (Knoop)
Flexural Strength
400 MPa (58 psi x 10 3)
Youngs Modulus
275 GPa (40 psi x 10 6)
Shear Modulus
112 GPa (16 psi x 10 6)
Thermal Expansion (25-300 Degrees C)
6.57 10 -6/ºC (3.64 10 -6/ºF)
Thermal Conductivity (25 Degrees C)
20.3 W/mK (141 BTU-in/ft 2-h-ºF)
Dielectric Strength
12 kv/mm (295 volts/mil)
Volume Resistivity
>10 14 ohm-cm 2/cm
Dielectric Constant (30GHz)
9.2
Dissipation Factor (1MHz)
0.0003 (Extrapolated Calculation)
ZIRCONIA TOUGHENED ALUMINA PROPERTIES
Color
White
Density
3.97 g/cc (0.143 #/cu. in.)
Hardness
1500 kg/mm 2
Flexural Strength
600 MPa (87 psi x 10 3)
Youngs Modulus
310 GPa (45 psi x 10 6)
Thermal Expansion (25-300 Degrees C)
8.10 10 -6/ºC (4.50x 10 -6/ºF)
Thermal Conductivity (25 Degrees C)
26 W/mK (180 BTU-in/ft 2-h-ºF)
Dielectric Strength
20 kv/mm (508 volts/mil)
Volume Resistivity
>1014 ohm-cm 2/cm
Dielectric Constant (30GHz)
10.8 (Extrapolated Calculation)
Dissipation Factor
0.0002 (Extrapolated Calculation)
ADDITIONAL INFORMATION
Applications
High Reliability Electronic and Industrial
Industries Served
  • Aerospace
  • High Frequency/High Temperature Electronics
  • High Reliability Industrial/Commercial
  • Medical
  • Military
Certifications
  • DFARS 252.225-7014 (Alternate 1) Compliant
  • ITAR Compliant
  • MIL-I-45208
  • RoHS Directive Compliant
Software Used
  • AutoCAD®
  • Autodesk®
  • Autodesk® Inventor™
  • Gerber Plot
  • IGES
  • IPC-D-356(A)
  • SolidWorks®
  • STEP

Multi Lab - Quartz and Ceramic Technology

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